Agenda

More Moore vs. More than Moore

Why 3D Integration

[ITRS] 2010年典型的 SiP 規格

IC Package Value Trend

2015年全球3D IC產值可達NT 1300億規模Logic+Memory堆疊市場最大

3D IC Market Applications

台灣晶圓代工、封測業全球第一3D IC利基型foundry、OSATs機會蓬勃

2009年台灣為全球3D IC最大量產國

The Markets for 3D IC

System Integration Trend

ASE SiP Roadmap

Wireless Packaging Technology Evolution

Integration Trends for Cell Phones

CMOS Image Sensor Applications

Toshiba-Chip Scale Chip Module

CMOS BSI Process Flow

BSI for CIS Applications

3D-WLP MEMS & Forecast per Application

3D Integration in MEMS Applications

下一波主力: 手機裡Logic+Memory堆疊

Samsung手機: Memory + Logic從PoP到3D IC

Package Trends on Baseband/Application Processor for Cell Phones

Logic+DRAM 廠商的整合搶攻3D IC商機

未來的手機

無限可能- Advanced Search Function

3D IC Technologies in ITRI

Post-Fab Wafer Processes

Supply Chain Infrastructure Evolution

TSMC 3D TSV Plans

3D-IC

3D IC Future Model

ITRI: Taiwan’s 1st 12 inch full 3DIC TSV integration line

台灣應由終端市場需求出發，做元件技術投入