The Opportunities of Smart Combo Sensor Are Looming —under the Trend of Heterogeneous Integration Technology
作者：謝孟玹
定價：免費
出版單位：工研院IEK
出版日期：2012/05/15
出版類型：產業評析
所屬領域：電子零組件及材料
瀏覽次數：1653
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摘要
The thickness of various smart phones presented by MWC in 2012 has reached the thin level as 7mm~9mm, and the thickness of Ultrabook PC, which notebook and PC manufacturers intend to present in the 2nd quarter, is between 17mm~23mm too. Under the circumstance that the thickness of terminal system tends to thinness gradually, however, the function of various built-in media processing transmission and wireless communication elements ....