An Observation of Domestic Suppliers and Current Market Condition from the Perspectives of Lead Frame Industry
作者：張致吉
定價：免費
出版單位：工研院IEK
出版日期：2015/09/04
出版類型：產業評析
所屬領域：電子零組件及材料
瀏覽次數：1049
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摘要
The lead frame industry was formed the earliest to supply the demand in IC packaging process. There were about ten domestic suppliers during the heyday of the industry. This article addresses the product specifications and the evolution from the perspectives of lead frame industry history and technology to witness the development of the packaging industry in Taiwan and provides insights into the development bottlenecks of the industry and future issues from the perspective of market demands.
內文標題/圖標題/表標題
I. The history of lead frame industry in Taiwan
II. An analysis of global lead frame market trend and product composition
III. Future Observation Focus
Fig 1. Evolution of lead frame pin counts
Fig.2 History of Taiwan’s semiconductor packaging and lead frame industry
Fig 3 . Global lead frame market scale
Fig.4 Estimation of 2014 global lead frame suppliers’ market shares
Table 1: Brief description of Taiwan’s major lead frame suppliers