2020 Taiwan Industrial Outlook-Electronics Materials
作者：Jing Han Chen
定價：免費
出版單位：工研院產科國際所
出版日期：2020/09/16
出版類型：產業評析
所屬領域：電子零組件及材料
瀏覽次數：742
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摘要
In the semiconductor materials industry, due to the impact of the US-China trade war and the decline in the memory market, there has been a slight decline in this industry. According to the annual silicon wafer industry analysis report released by Silicon Manufacturers Group (SMG), the total area of silicon wafer production in 2019 is 11,810 (MSI), compared with the combined total area of 12,732 (MSI) in 2018.
IC packaging material industry, the known material is IC substrate. It is mainly divided into ABF and BT substrate. ABF substrate, demand for 5G technology, intelligence, 5G cell site, etc. BT substrate demand memory, set up box (STB), antenna in package (AiP) modules.
內文標題/圖標題/表標題
I. Industry Scope
II. 2019 Review
III. Technology Trends for Emerging Products
IV. The "5+2" Innovation
V. Nations in the New Southbound Policy
VI. Outlook for 2020
Figure 1 Definition & Scope of Electronic Materials Industry
Table 1 Market Growth and Changing Trends for the Global & Taiwanese Electronic Materials Industry in 2019
Table 2 2020 Market Forecasts and Key Observations for Global and Taiwanese Electronic Materials Industries