2024 Taiwan Industrial Outlook – Semiconductor
作者：Hsuan-Chih Wang, Chia-Chen Lee,Cheng-Yi Li, Terry Fan, Hui-Hsiu Huang, Yunnie Chang, Nancy Liu, and Shu-Ting Chung
定價：電子檔 2500 元/點
出版單位：工研院產科國際所
出版日期：2024/10/18
出版類型：產業評析
所屬領域：半導體
瀏覽次數：146
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摘要
The semiconductor industry categories include semiconductor design/fabless, semiconductor fabrication, semiconductor packaging and testing, as well as an upstream wafer, chemical material, lead frame, substrate and peripheral supporting industry such as processing and inspection equipment. The semiconductor industry mentioned in the study only include the semiconductor design/fabless, semiconductor fabrication, and semiconductor packaging/testing, excluding photomask and wafer material, etc. For the division of labor in Taiwan, Taiwan IC industry can be classified as IC design, IC fabrication, and IC packaging/testing from upstream to downstream.
內文標題/圖標題/表標題
I. Industry Category
II. 2023 Industry Overview
III. Impact Analysis on Material Issues
IV. Technical Trend of Emerging Product
V. New Southbound Countries
VI. 2024 Industry Outlook
Figure 1. Structures of Taiwan IC Industry
Table 1. Definition of IC Industry