Development Trends and Future Outlook of IC Assembly and Testing Industries in Taiwan

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字數 887
頁數 4
出版作者 Chi-hsin Yang
出版單位 工研院IEK電子分項
出版日期 2016/12/06
出版類型 產業評析
所屬領域 半導體
瀏覽次數 4276
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摘要

Global semiconductors were affected by systematic risks caused by the poor overall economy since 2015, such as the European debt crisis and the drop in oil prices due to oversupply, resulting in the capacity utilization periodicity of semiconductor manufacturers’ foundries and assembly and testing plants to gradually disappear, and has declined every quarter in the past year. This also caused major global and Taiwan assembly and testing plants to use this recession to perform integration and layout in order to ensure future survival, making early preparations for future markets and customers.

內文標題/圖標題

1.Semiconductor Assembly and Test Services Supply Chain Has Reached Rock Bottom and Bounced Back, Recovering Every Quarter in 2016

2.Taiwan’s Overall Assembly and Testing Industry Is Out of Recession from the Second Quarter of 2016 and Started to Grow

3.Summary

Figure 1. Taiwan semiconductor and secondary industry output value and annual growth rate

Figure 2. Revenue growth rate of various categories of assembly and testing industry

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